Surface modification of the aramid fiber using the fluorine gas and the formation of the plating film with high adhesion
abstract
Aramid fiber is the superior to conventional fiber in tensile strength ,toughness and heat resistance .And it can be used for a bulletproof jacket,fire prevention clpthes.However ,application fields have been limited as a special use for high strength and heat resistance because it is diffcult ofthe processng and dyeing due to hardness.
By the metal platinf on the copper wire having light weight and flexibillty. However ,it has a problem of adhesion between fibers and metal plating films.To solve this adhesion,the fiber were investigated on the adhesion between fibers and metal plating films.
For the fluorination,the aramid fiber (100mm)was carried out at R.T for 1h under various fuorine pressures (10 100 380 608torr) using F2gas.and then the samples were plated by the erectroless Ni platinf method.the surface states and surface morphologies of samplses were analyzed using XPS,SEM,tensile strength test.
I confirmed a change of the aramid fiber surface by performing fluorination under various conditions. I confirmed that the surface was fluorinated enough in 10torr by XPS result. In addition, as for the sample which gave fluorination more than 100torr, plating tended to be easy to come off an SEM image. There was a gap to the sample of sample and 10torr of non-processing between fiber and plating films. In addition, as a result of having performed the strength examination of each sample, the big improvement was not seen. This fluorination condition does not lead to the coherency improvement with the plating film, but can think that I can expect improvement to hydrophilize the surface by mixed gases processing with introduction and oxygen of the different fluorination condition, e.g., different fluorine system gas (NF3 and ClF3 gas).
abstract
Aramid fiber is the superior to conventional fiber in tensile strength ,toughness and heat resistance .And it can be used for a bulletproof jacket,fire prevention clpthes.However ,application fields have been limited as a special use for high strength and heat resistance because it is diffcult ofthe processng and dyeing due to hardness.
By the metal platinf on the copper wire having light weight and flexibillty. However ,it has a problem of adhesion between fibers and metal plating films.To solve this adhesion,the fiber were investigated on the adhesion between fibers and metal plating films.
For the fluorination,the aramid fiber (100mm)was carried out at R.T for 1h under various fuorine pressures (10 100 380 608torr) using F2gas.and then the samples were plated by the erectroless Ni platinf method.the surface states and surface morphologies of samplses were analyzed using XPS,SEM,tensile strength test.
I confirmed a change of the aramid fiber surface by performing fluorination under various conditions. I confirmed that the surface was fluorinated enough in 10torr by XPS result. In addition, as for the sample which gave fluorination more than 100torr, plating tended to be easy to come off an SEM image. There was a gap to the sample of sample and 10torr of non-processing between fiber and plating films. In addition, as a result of having performed the strength examination of each sample, the big improvement was not seen. This fluorination condition does not lead to the coherency improvement with the plating film, but can think that I can expect improvement to hydrophilize the surface by mixed gases processing with introduction and oxygen of the different fluorination condition, e.g., different fluorine system gas (NF3 and ClF3 gas).